Plasma Etching Equipment - Company Ranking(6 companies in total)
Last Updated： Aggregation Period:Feb 18, 2026〜Mar 17, 2026
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| Standard Specifications Stage Dimensions: 250 mm□ Etching Method: RIE CF Gas Standard Simple mechanism allows switching between RIE/DP... | MEMS sensor etching: SiN SiO2, Si Electronic component etching: SiO2 Pre-deposition light etching of semiconductor wafers (removal of na... | ||
| A high-density plasma etching device that is compatible with the conventional etching devices "SERIO" and "EXAM" in its basic configuration.... | Cu thin film etching Thin film magnetic head Cu etching Photomask etching High-density interconnection substrate Cu etching | ||
| 【Specifications】 ■ Hardware Configuration: Load-lock type, consisting of one load-lock chamber and one etching chamber * Multi-chambe... | 【Applications】 ■ Deep Si etching ■ Vertical processing of quartz ■ Formation of sacrificial layers ■ Oxynitride film ■ Etching of organic fi... | ||
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神港精機 東京支店
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- Featured Products
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Plasma etching device "EXAM" sample testing now accepting applications.
- overview
- Standard Specifications Stage Dimensions: 250 mm□ Etching Method: RIE CF Gas Standard Simple mechanism allows switching between RIE/DP...
- Application/Performance example
- MEMS sensor etching: SiN SiO2, Si Electronic component etching: SiO2 Pre-deposition light etching of semiconductor wafers (removal of na...
Cu etching compatible high-density plasma etching device
- overview
- A high-density plasma etching device that is compatible with the conventional etching devices "SERIO" and "EXAM" in its basic configuration....
- Application/Performance example
- Cu thin film etching Thin film magnetic head Cu etching Photomask etching High-density interconnection substrate Cu etching
ICP plasma etching device "SERIO"
- overview
- 【Specifications】 ■ Hardware Configuration: Load-lock type, consisting of one load-lock chamber and one etching chamber * Multi-chambe...
- Application/Performance example
- 【Applications】 ■ Deep Si etching ■ Vertical processing of quartz ■ Formation of sacrificial layers ■ Oxynitride film ■ Etching of organic fi...
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神港精機 東京支店
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