Plasma Etching Equipment - Company Ranking(6 companies in total)
Last Updated： Aggregation Period:Dec 24, 2025〜Jan 20, 2026
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Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| 【Specifications】 ■ Hardware Configuration: Load-lock type, consisting of one load-lock chamber and one etching chamber * Multi-chambe... | 【Applications】 ■ Deep Si etching ■ Vertical processing of quartz ■ Formation of sacrificial layers ■ Oxynitride film ■ Etching of organic fi... | ||
| Atmospheric transport type CtoC system compatible with 3 to 8-inch wafers. Based on a parallel plate RIE device, it achieves soft mode plasm... | Power device ashing Discrete IC etching (removal of natural oxide film, pre-treatment before electrode formation) MEMS device ashing and... | ||
| A high-density plasma etching device that is compatible with the conventional etching devices "SERIO" and "EXAM" in its basic configuration.... | Cu thin film etching Thin film magnetic head Cu etching Photomask etching High-density interconnection substrate Cu etching | ||
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神港精機 東京支店
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- Featured Products
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ICP plasma etching device "SERIO"
- overview
- 【Specifications】 ■ Hardware Configuration: Load-lock type, consisting of one load-lock chamber and one etching chamber * Multi-chambe...
- Application/Performance example
- 【Applications】 ■ Deep Si etching ■ Vertical processing of quartz ■ Formation of sacrificial layers ■ Oxynitride film ■ Etching of organic fi...
Single-wafer plasma etching device "EXAM-Σ"
- overview
- Atmospheric transport type CtoC system compatible with 3 to 8-inch wafers. Based on a parallel plate RIE device, it achieves soft mode plasm...
- Application/Performance example
- Power device ashing Discrete IC etching (removal of natural oxide film, pre-treatment before electrode formation) MEMS device ashing and...
Cu etching compatible high-density plasma etching device
- overview
- A high-density plasma etching device that is compatible with the conventional etching devices "SERIO" and "EXAM" in its basic configuration....
- Application/Performance example
- Cu thin film etching Thin film magnetic head Cu etching Photomask etching High-density interconnection substrate Cu etching
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神港精機 東京支店
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