Plasma Etching Equipment - Company Ranking(6 companies in total)
Last Updated： Aggregation Period:Nov 05, 2025〜Dec 02, 2025
This ranking is based on the number of page views on our site.
Display Company Information
| Company Name | Featured Products | ||
|---|---|---|---|
| Product Image, Product Name, Price Range | overview | Application/Performance example | |
| Standard Specifications Stage Dimensions: 250 mm□ Etching Method: RIE CF Gas Standard Simple mechanism allows switching between RIE/DP... | MEMS sensor etching: SiN SiO2, Si Electronic component etching: SiO2 Pre-deposition light etching of semiconductor wafers (removal of na... | ||
| A high-density plasma etching device with a simple structure. It is easy to accommodate larger diameters and is suitable for processing wafe... | Etching of wafers over 200 mm, Si, Si nitride film, oxide film, metal film, organic film, photoresist removal, photo mask etching, large hig... | ||
| 【Specifications】 ■ Hardware Configuration: Load-lock type, consisting of one load-lock chamber and one etching chamber * Multi-chambe... | 【Applications】 ■ Deep Si etching ■ Vertical processing of quartz ■ Formation of sacrificial layers ■ Oxynitride film ■ Etching of organic fi... | ||
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神港精機 東京支店
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- Featured Products
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Plasma etching device "EXAM" sample testing now accepting applications.
- overview
- Standard Specifications Stage Dimensions: 250 mm□ Etching Method: RIE CF Gas Standard Simple mechanism allows switching between RIE/DP...
- Application/Performance example
- MEMS sensor etching: SiN SiO2, Si Electronic component etching: SiO2 Pre-deposition light etching of semiconductor wafers (removal of na...
HCD type high-density plasma etching device
- overview
- A high-density plasma etching device with a simple structure. It is easy to accommodate larger diameters and is suitable for processing wafe...
- Application/Performance example
- Etching of wafers over 200 mm, Si, Si nitride film, oxide film, metal film, organic film, photoresist removal, photo mask etching, large hig...
ICP plasma etching device "SERIO"
- overview
- 【Specifications】 ■ Hardware Configuration: Load-lock type, consisting of one load-lock chamber and one etching chamber * Multi-chambe...
- Application/Performance example
- 【Applications】 ■ Deep Si etching ■ Vertical processing of quartz ■ Formation of sacrificial layers ■ Oxynitride film ■ Etching of organic fi...
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神港精機 東京支店
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