Plasma Etching Equipment - 企業ランキング(全3社)
更新日： 集計期間:Jul 16, 2025〜Aug 12, 2025
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| 製品画像・製品名・価格帯 | 概要 | 用途/実績例 | |
| 【Other Features】 ■ To control ion energy at high density, 2MHz is applied to the lower electrode (optional) ■ Cleaning process (O2) after each etching process removes fluorocarbon films adhered to the electrodes and chamber walls *For more details, please refer to the PDF document or feel free to contact us. | For more details, please refer to the PDF document or feel free to contact us. | ||
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片桐エンジニアリング
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- 代表製品
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CCP plasma etching device 'CCP-T60M/B2M'
- 概要
- 【Other Features】 ■ To control ion energy at high density, 2MHz is applied to the lower electrode (optional) ■ Cleaning process (O2) after each etching process removes fluorocarbon films adhered to the electrodes and chamber walls *For more details, please refer to the PDF document or feel free to contact us.
- 用途/実績例
- For more details, please refer to the PDF document or feel free to contact us.
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片桐エンジニアリング
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